Encapsulation of electronic assemblies
Protection and durability for your products
Our Services in the Field of Encapsulation
- Encapsulation of printed circuit boards, modules, and complete assemblies
- Processing of 1-component and 2-component encapsulation compounds
- Partial and full encapsulation depending on customer-specific requirements
- Protection against moisture, dust, chemicals, and vibrations
- Thermally conductive potting compounds for high-performance applications
- Clean, reproducible processes using modern dosing and mixing technology
- CNC positioning for consistent quality
- Vacuum processing of the potting compound
Your benefits
- Significantly extended service life of the electronics
- Reliable protection in demanding operating environments
- Improved heat dissipation for high-performance components
- Customized material selection tailored to function and environment
- High process reliability and documented quality
Typical applications
- Automotive electronics
- Industrial and sensor technology
- Power electronics and power supplies
- Outdoor devices and IoT modules
- Medical technology and infrastructure applications